JEDEC: Spezifikationen von HBM4 rücken näher [ComputerBase]
nVidia, SK Hynix & TSMC Forge New Alliance To Accelerate GPU & HBM4 Development For Next-Gen AI Standards [WCCF Tech]
Samsung Reportedly Passes nVidia’s HBM3E Qualification Tests, Supply Expected To Initiate Next Quarter [WCCF Tech]
Quinas Technology’s “UltraRAM” Offers 10 Million Rewrite Cycles & 1,000 Years Of Data Retention [WCCF Tech]

Kingston Fury DDR5-Speicher im Rennwagen Design [TweakPC]
CUDIMM Standard Set to Make Desktop Memory a Bit Smarter and a Lot More Robust [AnandTech]
All 3 major DRAM makers are expanding production of HBM chips [Dan Nystedt @ X]
How Much RAM Do Gamers Need: 16GB vs. 32GB vs. 64GB [Hardware Unboxed @ YouTube]

Superschnelles RAM & PCI Express: DDR6, LPDDR6, GDDR7, HBM4 und PCIe 7.0 [Heise]
Höchste Speicherkapazität: BiCS8 QLC 3D-NAND mit 256 GB passt locker auf einen Zeigefinger [ComputerBase]
DRAM contract prices will rise 13%-18% in the 2nd quarter as PC makers agree to higher prices [Dan Nystedt @ X]
SK Hynix plans to start mass production of GDDR7 in the fourth quarter of this year [Hassan Mujtaba @ X]
Memory Markets To Experience a “Supply Shock”, As AI-Driven Demand Comes In For The Rescue [WCCF Tech]
Lexar Unveils 9600 MT/s DDR5 CUDIMM Memory, Mainstream & High-End Gen5 SSDs & DDR5 Solutions [WCCF Tech]

Dank KI-Boom: RAM ist wieder "sexy", aber auch für Spieler? [PC Games Hardware]
DDR5 auf CAMM2: G.Skill demonstriert schnellen Speicher auf der Computex 2024 [PC Games Hardware]
CUDIMM und CAMM2: Neue Speichervarianten als heimliches Highlight der Messe [Hardwareluxx]
CAMM2 könnte DIMM-Speicher schon bald ersetzen [Golem]
Trident Z5 CK is a new generation of CU-DIMM memory [Charlie @ X]
DDR5 CU-DIMM: September 2024 [Harukaze5719 @ X]

GDDR7: Micron legt Grundstein für 1,5 TB/s auf Grafikkarten [ComputerBase]
SK Hynix GDDR7 @ Computex [WCCF Tech]
nVidia CEO Refutes Claims Of Samsung Failing HBM3 Verification, Says There’s More Testing To Be Done [WCCF Tech]

DDR5-RAM-Preise im Detail geprüft: Ab dieser Taktstufe wird es teuer [PC Games Hardware]
Team Group lockt mit DDR5-10000 und LPCAMM2 [ComputerBase]
GeIL: Zur Computex gibt es DDR5-10200 und (LP)CAMM2 [ComputerBase]
Samsung verspricht 3D-DRAM ab 2030 [Golem]
SK Hynix To Integrate Computing & Caching Functionalities With Next-Gen HBM4E Memory [WCCF Tech]

Trident Z5 Royal: 96 GiB und 8.400 MT/s im königlichen Gewand [PC Games Hardware]
Zu viel Strom und Wärme?: Samsung dementiert Berichte über mangelhafte HBM-Chips [ComputerBase]
LPDDR6 CAMM2: Die Zukunft bringt wechselbaren Speicher mit bis zu 14,4 GT/s [ComputerBase]
LPDDR6 Specs [Darkmont @ X]
DDR6 Specs [Darkmont @ X]

G.Skill Ripjaws M5 RGB: Dezente Heatspreader mit RGB treffen gut verträgliche Spezifikationen [PC Games Hardware]
SODIMM, LPDDR & LPCAMM Roadmap 2021-2027 [Harukaze5719 @ X]
Samsung & SK hynix Eye 1c DRAM As The Choice For HBM4 Memory, TSMC Preps HBM4 Base Dies On 12nm & 5nm [WCCF Tech]
HBM3e Production Surge Expected to Make Up 35% of Advanced Process Wafer Input by End of 2024 [Trendforce]

Crucial DDR5/5600 Pro und DDR5/6000 Pro Overclocking Kits im Test mit Teardown und OC [Igor's Lab]
Samsung and SK Hynix abandon DDR3 production to focus on unrelenting demand for HBM3 [Tom's Hardware]
Samsung Has Reportedly Failed To Pass HBM3E Memory Qualification Tests Set By nVidia [WCCF Tech]
SK Hynix Reveals Plans For Cutting-Edge HBM4E Memory, Development Expected By 2026 [WCCF Tech]

Micron Is The First Manufacturer To Ship 128 GB DDR5 RDIMM For Servers, Up To 8000 MT/s [WCCF Tech]
SK Hynix Reports That Its 2025 HBM Volume Is Almost Sold Out, 12-Hi HBM3E Production Next Quarter, 16-Hi HBM4 In 2028 [WCCF Tech]
DRAM Contract Prices for Q2 Adjusted to a 13–18% Increase [TrendForce]

LPCAMM2: Lenovo ThinkPad setzt neue Maßstäbe mit revolutionärem Speicher [TweakPC]
Samsung HBM3E 12-Hi Mass Production Commences In Q2 [WCCF Tech]
Rambus Presents First GDDR7 Memory Controller in the Age of AI 2.0 [All About Circuits]